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TF Users Group - Proceedings

2005
 February
Metrology of: SOI, SiGe/SGOI, Strained Si, Bipolars and others
  Laurent Kitzinger, SOPRA SA

Modern SOI Materials
  Jean-Pierre Colinge, University of California, Davis

SiGe Epi deposition for NPN HBT base layer
  Sagy Levy, Cypress Semiconductor Process R&D

 May
Equipment Supplier?s Perspective on the Evolution of Si Technology Development
  Gregg S. Higashi, Ph.D., Applied Materials

Optical Measurement of Thickness and Properties of Ultra-Thin Films in Complex Multi-Layer Film Stacks Used in MRAM Fabrication
  Alexander Gray, n&k Technology, Inc.

 June
CVD deposited low k dielectrics for gap-fill applications.
  John Macneil, Trikon Technologies, Inc.

Optical Metrology of Low-k Dielectrics
  Phillip Walsh, n&k Technology, Inc.

 September
Comprehensive Metrology Tools for Characterization and Measurements of Ultra-Thick Films, Determination of Optical Properties of Materials
  John Lam, n&k Technology, Inc.

 December
W Metallization in a 3-D Memory
  Michael Konevecki, Matrix Semiconductor

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