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Junction Technology Group - Proceedings

February 2015
Topic: Technology Innovation for Next Generation Materials and Manufacturing
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Message from Indium Corporation (401k pdf)
- Jacques Matteau, Indium Corporation

Nanotechnology in Next Generation Devices and Manufacturing (N/A)
- Meyya Meyyappan, NASA Ames Research Center

Low Emissivity (Low-E) Coating Technologies for Energy Saving Window Applications (13.5MB pdf)
- Guowen Ding, Intermolecular

Coupling of Surface Light into Lateral Modes of a Waveguide or Photonic Resonant Structure, A Finite Difference Finite Time Model Approach to High Accuracy and High Optical Coupling Efficiency (N/A)
- Ernest Demaray, Antropy Inc.

40 Years of Magnetron Sputtering: Still an Exciting Field for Discovery (13.5MB)
- Andre Anders, Lawrence Berkeley National Laboratory

Using Plasmas to Trap Antihydrogen Atoms (N/A)
- Joel Fajans, UC Berkeley

Mechanisms for Ultra-Low Temperature Plasma Activated Direct Wafer Bonding (N/A)
- Garrett Oakes, EVGroup

High Efficiency Multi-Junction Solar Cell Based on Diluted Nitrides (N/A)
- Ferran Suarez, Solar Junction

New Applications of Chemical Mechanical Polishing (3.5MB)
- Rob Rhoades, Entrepix, Inc.

Advanced Techniques for Simulating Material Properties and Manufacturing Processes (N/A)
- Mike Hook, Cobham

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