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Junction Technology Group - Proceedings

July 2010
Topic: New Junction Fabrication Capabilities: Implanters, Annealers, Materials and Metrology

22nm Node p+ & n+ USJ Options, (3.4MB pdf)
-John Borland, J.O.B. Technologies

Pulsion HP Plasma Doping,
-Susan Felch, Ion Beam Services
(1.1MB pdf)

Millios millisecond flash anneal for 22nm node,
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Steve McCoy (or Sing-Pin Tay), Mattson Technology (1.3MB pdf)

Laser Annealing for Ni-Silicide Yield Improvement,
-Shankar Muthukrishnan, Applied Materials
(964k pdf)

Laser Macro & Micro Uniformity Analysis Using Hx-4PP and TW,
-Walt Johnson, KLA-Tencor
(2.2MB pdf)

Molecular Implant for Advance USJs,
-Wade Krull, SemEquip
(1.4MB pdf)

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