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Junction Technology Group - Proceedings

October 2008
Topic: Damage, Defects, Strain and Leakage

Modeling stress, defect evolution, and junction leakage (1.7MB pdf)
- Victor Moroz, Synopsis

Carrier recombination-based metrology tools for junction processing (5.7MB pdf)
- Michael Current, Current Scientific

Optimization of diffusion, activation and damage annealing in millisecond annealing (659K pdf)
- Paul Timans, Mattson Technology

Strain effects in millisecond laser annealing (813K pdf)
- Yun Wang, Ultratech

Automated differential-Hall profiling for defect characterization (722K pdf)
- Si Prussin, UCLA

In-line process and equipment performance monitoring using site flatness and Raman mapping (1.7MB pdf)
- Woo Sik Yoo, WaferMasters

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