Abstracts are now being accepted for the Chemical Mechanical Planarization Users Group (CMPUG) April 13, 2017 Symposium on Advances in CMP Consumables, Materials and Tools. The symposium will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP semiconductor technology. The CMPUG promotes the exchange of opportunities, ideas, friendly relationships and research collaboration. The areas of focus for this meeting will be the following:
- CMP consumables and materials
- CMP Polishing and Metrology Tools
- CMP Process Integration
Please submit an abstract (less than 200 words) of your presentation by March 22, 2017 to the meeting Co-Chairs, Michael Pevny, email@example.com and Jeff McKinnis firstname.lastname@example.org
Authors will be notified of acceptance by return e-mail.
All accepted presenters are required to submit their presentations in pdf or pptx format, approved by their respective organizations/employers for public release, by April 6, 2017.
All presentations will be posted on the CMPUG Proceedings webpage and will be live via Webcast.
If you would like to sponsor this meeting or list a banner ad on the User Group website, please check out our “NCCAVS Marketing/Sponsorship” opportunities at: