Chemical Mechanical Polishing (CMP) is a technology
used for planarization and surface finishing
in the manufacture of silicon wafers, integrated circuits (IC's), magnetic heads and micro-electromechanical devices (MEMS).
CMP is recognized as the premiere method for
achieving ultraflat and ultrasmooth surfaces
when they are most critical, thus enabling
many of the advanced electronic devices
currently in production. At various
steps in the process flow, surface bumps or
topography from the underlying layers can
cause yield-limiting problems for the next
process step. CMP was developed
specifically to address these issues.
Since its mainstream introduction in the
mid-1990's, applications have continued to
grow rapidly in both volume and complexity.
None of the advanced microprocessor or
memory circuits manufactured today would be
possible in their current form without
multiple CMP process steps. Newer
technologies, such as 3D packaging and
thru-silicon vias, also continue to leverage
CMP for its unique planarization
The CMP Users Group (CMPUG) was formed in October 1995 to explore the issues and challenges associated with this fast growing technology. The CMPUG's main activity is a quarterly meeting with technical presentations on a topic of interest to the CMP community.
Admission to the quarterly technical meetings and membership in the CMPUG is FREE and open to anyone involved or interested in
joining the CMP Users Group, including those in device and equipment manufacturing, academia, or consulting.
is a charter co-sponsor of the International
Conference on Planarization/CMP Technology (ICPT)
which is held every fall in the
October/November timeframe. ICPT is hosted
on a rotating basis among the five
international CMP Users Groups in Europe,
Japan, Korea, Taiwan, and USA. ICPT '06 was held in the Foster City, CA USA, ICPT '07 was
held in Dresden, Germany, ICPT '08 was hosted by the Taiwanese
User Group in Hsinchu, Taiwan, ICPT '09 was
Fukuoka, Japan and ICPT '10 was held in Phoenix,
AZ USA. The next ICPT is being
planned in Seoul, Korea, November 9-11, 2011
and will return the Europe in 2012.
To join, simply enter your contact info here. Once you are on the e-mail distribution list you will receive Call for Papers and Meeting announcements prior to each meeting.