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2005 Annual
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CMP Users Group - Proceedings

2006
 April
CMP nHancement Applications Using ViPRR Carrier Technology
  Lily Yao, Strasbaugh

PolyCrystalline Diamond Conditioners for Dressing CMP Pads: An Enabling Technology for Manufacturing Future Semiconductor Devices
  James C. Sung, Advanced Diamond Solutions

What Does The Future Hold?
  Dean Freeman, Gartner

 June
Direct-Polish STI CMP Process For Next Generation Gap Fill Technologies
  G. Prabhu, Applied Materials

Modeling Layout Dependant Within die Non-uniformity In High Selectivity STI CMP
  Jihong Choi, University of California at Berkeley

Removal Rate Controlled Ceria Slurries for Low Defectivity and High Planarity in DSTI CMP
  James Shen, Cabot Microelectronics Corp.

The Next Generation of Direct STI slurry, Lower COO, Improved Process Window, Reduced Defects, and Improved Stability
  Jim Rothenberger, DuPont Company

Tunable Polysilicon Polishing Slurry Platforms
  James Shen, Cabot Microelectronics Corp.

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